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The growing need for energy-efficient computing has led to many novel system innovations, including liquid immersion cooling. While many myths about the technology have been dispelled, the actual impact of this cooling solution on thermal conditions in real computing scenarios remains under-reported and under-studied. In this work, we collate data from multiple system monitoring tools to perform case-study analyses of the thermal behaviors of immersed hardware, aiming to evaluate the effectiveness of liquid immersion cooling for high-performance and datacenter applications. 

The abstraction of a shared memory space over separate CPU and GPU memory domains has eased the burden of portability for many HPC codebases. However, users pay for ease of use provided by system-managed memory with a moderate-to-high performance overhead. NVIDIA Unified Virtual Memory (UVM) is currently the primary real-world implementation of such abstraction and offers a functionally equivalent testbed for in-depth performance study for both UVM and future Linux Heterogeneous Memory Management (HMM) compatible systems. The continued advocacy for UVM and HMM motivates improvement of the underlying system. We focus on UVM-based systems and investigate the root causes of UVM overhead, a non-trivial task due to complex interactions of multiple hardware and software constituents and the desired cost granularity. In our prior work, we delved deeply into UVM system architecture and showed internal behaviors of page fault servicing in batches. We provided quantitative evaluation of batch handling for various applications under different scenarios, including prefetching and oversubscription. We revealed that the driver workload depends on the interactions among application access patterns, GPU hardware constraints, and host OS components. Host OS components have significant overhead present across implementations, warranting close attention. This extension furthers our prior study in three aspects: fine-grain cost analysis and breakdown, extension to multiple GPUs, and investigation of platforms with different GPU-GPU interconnects. We take a top-down approach to quantitative batch analysis and uncover how constituent component costs accumulate and overlap, governed by synchronous and asynchronous operations. Our multi-GPU analysis shows reduced cost of GPU-GPU batch workloads compared to CPU-GPU workloads. We further demonstrate that while specialized interconnects, NVLink, can improve batch cost, their benefits are limited by host OS software overhead and GPU oversubscription. This study serves as a proxy for future shared memory systems, such as those that interface with HMM, and the development of interconnects.